TenSKy Technology Co., Ltd.

COB Ceramic Substrate Integrated, Electronic Accessories and Supplies

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TenSKy Technology Co., Ltd.
[Taiwan]

Address
No.135, Chenggong 2nd St . ,Jhubei City , Hsinchu County 302,Taiwan (R.O.C.) Taiwan Hsinchu County
Phone
886-3-5905018
Contact name
Richard Yeh

Quick Information

  • Place of Origin: Taiwan
  • :

Description

Tensky ceramic PCB is made up of innovative, research and development engineers the configuration, the target is the first leader professional Ceramic base plate, ceramic circuit board brought to workshop, using a semiconductor membrane technology for a customer with OEM/ODM service, Resolution, Customer in electronic circuit in various thermal heating, high pressure, and the problem.

Main materials:Al2O3 and AlN substrate.

Image layers metal:Ti, TiW, Cu , Ni, Pd , Au , Ag, AuSn, Sn, Al…and other metallize。

Primary market:high-power LED stand, cooling, optical communication components, optical power solar energy base plate, vehicle with electrical, air, and the electronic circuit board roadbed, and so on.

The special is high power LED market context, such as 1515, 2016, 3535, 5050, 6060, 1215 substrate, and  LED - COB integrated stand, practices, as well as UVLED stand, etc. product is the Secretary's main work specifications, provide customer professional views, reduced customer test and failure risk. 

 

Introduction: 

 

This section of the ceramic substrate design concept is to allow high power, small size, high brightness LED use 

development designed to replace a section merit system board, directly to multiple LED chip package on top, 

and then by the second optical lens more compact size makes the product volume and let your light LED 

products reduce the area, reducing materials, system cost, the human cost of replacing the assembly, so 

that you package more quickly, Wire bonding the chip directly on the substrate, with the use of ceramic 

heat with excellent results, but also allow your LED brighter and longer life. 


This product suitable for high power LED's package, such as: bulb, downlight, LED lights.

Specifications:

Thermal conductivity: Al2O3 - 23 ~ 27W/mk AlN - 170 ~ 240W/mk
Palting: Ag, Au
Size: 10mmx10mm (3x3), 25mmx22mm (5x5), 28mmx28mm (7x7), 32mmx32mm (10x10)
Thickness: 1mm ~ 1.2mm
Load power: 5w ~ 100w


For more info please check www.tensky.com.tw

We will very pleaseure to involve business with you. Please don't be hesitate to contact with us.



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