Ceramic Substrate,Ceramic PCB,Ceramic Metallization,AlN,Al2O3,Direct Plating Copper,DPC,DBC,Ceramic

Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate

 The integration of the thin film,thick film,electrode plating and electroless plating processes

Application: 

1. High Power LED ceramic substrate

2. Microwave (Wireless Communication & Radar)

3. Semiconductor Process Equipment

4. Solar Cell 

5. Hybrid Electric Vehicles

6.Flip chip/eutectic substrate

7.Sensor ceramic substrate

For more info please checkwww.tensky.com.tw

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