LED Substrate,Ceramic PCB, Ceramic Substrate, Thick Film Ceramic,Thin Film Ceramic,Ceramic Metallize

Al2O3-3x3 for 5~6W (pnl:116.6x57.15mm for 36pcs) Size:12x12xt0.5mm with 0.7~0.8mm 

silicon cavity Chips size: 24mil~35mil LED COB ceramic substrate

 Al2O3--3x3 for 9 die and 5~6Wt used Al2O3--5x5 for 25 die and 20 Wt used AlN--7x7 for 49 die and 50Wt used AlN 10x10 for 100 die and 100Wt used Ceramic metallized: 

Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit plating: 1um~150um Ceramic Metallized substrate

: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate:

 LED COB ceramic substrate LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: 

The integration of the thin film,thick film,electrode plating and electroless plating processes: Application:

1. High Power LED ceramic substrate

2. Microwave (Wireless Communication & Radar) 

3. Semiconductor Process Equipment

4. Solar Cell 

5. Hybrid Electric Vehicles

6.Flip chip/eutectic substrate 

7.Sensor ceramic substrate

For more info please checkwww.tensky.com.tw

We will very pleaseure to involve business with you. Please don't be hesitate to contact with us.